Improved resistive switching reliability by using dual-layer nanoporous carbon structure
Improved resistive switching reliability by using dual-layer nanoporous carbon structure
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DOI:
10.1063/1.5003331
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发表时间:
2017-10
影响因子:
4
通讯作者:
Ye Tao;Xuhong Li;Zhongqiang Wang;Haiyang Xu;Wentao Ding;Jiangang Ma;Yichun Liu
中科院分区:
文献类型:
--
作者:
Ye Tao;Xuhong Li;Zhongqiang Wang;Haiyang Xu;Wentao Ding;Jiangang Ma;Yichun Liu
We optimized the diameter and microgeometry of preformed conductive filaments (CFs) to improve the switching reliability of copper/nanoporous amorphous carbon (a-C)/platinum memory devices. Forming-free devices were obtained because of the introduction of preformed CFs into the nanoporous layer during the copper electrode evaporation process. The switching fluctuation decreased with the increasing preformed CF size in a certain range; however, the device with stronger preformed CFs suffered from high current in the first RESET process. Furthermore, to achieve both high switching uniformity and low power consumption, a dual-layer structure was proposed to regulate the microgeometry of preformed CFs. Compared with those of a pristine device and single-layer nanoporous device, the fluctuation of high/low resistance values was further suppressed to 26% and 21%, respectively. In addition, Resistive random access memory (RRAM) devices exhibited a fast switching speed ( 105 cycles),...