An experimental technique to determine critical stress intensity factors for delamination initiation
An experimental technique to determine critical stress intensity factors for delamination initiation
复制标题
确定分层引发的临界应力强度因子的实验技术
DOI：
10.1016/s0013-7944(02)00090-5
复制
发表时间：
2003
影响因子：
5.4
通讯作者：
S. Sitaraman
中科院分区：
文献类型：
--
作者：
W. Xie;S. Sitaraman
界面脱层是多层微电子封装中一个重要的可靠性问题。局部渐近解，线弹性假设的基础上，可用于估计自由边缘应力强度因子（SIF）。然而，为了能够预测分层开始，有必要确定临界自由边应力强度因子。本文提出了一种确定临界自由边应力强度因子的实验方法。该测试是基于简单和标准的剪切强度测试，这是由ASTM标准对表面贴装元件的规定，而不是专门设计或复杂的测试仪器和夹具。用所提出的测试方法确定了铜/ViaLuxTM 81光致干膜PDDF界面的临界自由边应力强度因子，并用有限元分析进行了校准。
Interfacial delamination is an important reliability concern in multilayered microelectronic packages. Local asymptotic solutions, based on linear elastic assumptions, are available for estimating the free-edge stress intensity factor (SIF). However, to be able to predict delamination initiation, it is necessary to determine the critical free-edge SIF. In this paper, an experimental method has been proposed and conducted to determine the critical free-edge SIF. The test is based on the simple and standard shear strength test, which is well specified by ASTM standard for surface mount components, as opposed to specially designed or complicated test apparatus and fixture. The critical free-edge SIF for copper/ViaLuxTM81 photo-definable dry film PDDF interface has been determined with the proposed test method and calibrated using finite element analysis.