Effect of substrate temperature on deposition behavior of copper particles on substrate surfaces in the cold spray process
Effect of substrate temperature on deposition behavior of copper particles on substrate surfaces in the cold spray process
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DOI：
10.1007/s11666-007-9121-9
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发表时间：
2007-12-01
影响因子：
3.1
通讯作者：
Izawa, M.
中科院分区：
文献类型：
--
作者：
Fukumoto, M.;Wada, H.;Izawa, M.
研究了冷喷涂过程中单个金属粒子在基体表面的沉积行为。作为初步实验，将纯铜（Cu）颗粒喷涂在镜面抛光的不锈钢和铝（Al）合金基底表面上。系统地改变的工艺参数是颗粒直径、工作气体、气体压力、气体温度和衬底温度，并且精确地研究了这些参数对单个颗粒的平坦化或粘附行为的影响。还使用这些参数评价了基板表面上的沉积率。从所获得的结果中，相当明显的是，更高的衬底温度带来更高的Cu颗粒沉积速率，即使在颗粒保持在室温下的条件下。使用氦气代替空气或氮气作为工作气体更有效地促进了这种趋势。较高的喷涂速度和喷涂温度是冷喷涂获得较高沉积率的必要条件。然而，代替颗粒加热，衬底加热可以为颗粒沉积带来等效效果。
The deposition behavior of sprayed individual metallic particles on the substrate surface in the cold spray process was fundamentally investigated. As a preliminary experiment, pure copper (Cu) particles were sprayed on mirror-polished stainless steel and aluminum (A]) alloy substrate surfaces. Process parameters that changed systematically were particle diameter, working gas, gas pressure, gas temperature, and substrate temperature, and the effect of these parameters on the flattening or adhesive behavior of an individual particle was precisely investigated. Deposition ratio on the substrate surface was also evaluated using these parameters. From the results obtained, it was quite noticeable that the higher substrate temperature brought about a higher deposition rate of Cu particles, even under the condition where particles were kept at room temperature. This tendency was promoted more effectively using helium instead of air or nitrogen as a working gas. Both higher velocity and temperature of the particles sprayed are the necessary conditions for the higher deposition ratio in the cold spraying. However, instead of particle heating, substrate heating may bring about the equivalent effect for particle deposition.