A novel hybrid power module with dual side-gate HiGT and SiC-SBD

A novel hybrid power module with dual side-gate HiGT and SiC-SBD
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一种新型双侧栅极 HiGT 和 SiC-SBD 混合功率模块

DOI:
10.23919/ispsd.2017.7988892
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发表时间:
2017
期刊:
2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)
影响因子:
--
通讯作者:
M. Mori
M. Mori
中科院分区:
--
文献类型:
--
作者:
Y. Takeuchi;T. Miyoshi;T. Furukawa;M. Shiraishi;M. Mori

文献摘要

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本文提出了一种新型混合功率模块,采用双侧栅 HiGT(高导率 IGBT)和 SiC-SBD 的新组合。与沟槽栅 HiGT 和 U-SFD(超软快恢复二极管)的传统组合相比,该组合可大幅降低开关损耗,关断损耗为 -43%,导通损耗为 -71%,反向恢复损耗为 -98%。因此,所提出的 DuSH 模块(双侧栅 HiGT 混合模块)具有极低的逆变器损耗(-50%),与 SiC-MOSFET 类似。
In this paper, a novel hybrid power module using a new combination of dual side-gate HiGTs (high-conductivity IGBT) and SiC-SBDs is proposed. This combination achieves drastic switching loss reductions at a turn-off loss of −43%, a turn-on loss of −71%, and a reverse recovery loss of −98% compared with a conventional combination of trench gate HiGTs and U-SFDs (ultra soft & fast recovery diode). As a result, the proposed DuSH module (dual side-gate HiGT hybrid module) has an extremely low inverter loss of −50%, similar to SiC-MOSFETs.