Challenges in converting to lead-free electronics
Challenges in converting to lead-free electronics
复制标题
转向无铅电子产品的挑战
DOI：
10.1109/eptc.2000.906340
复制
发表时间：
2000
期刊：
影响因子：
--
通讯作者：
R. Aspandiar
中科院分区：
文献类型：
--
作者：
C. M. Garner;V. Gupta;V. Bissessur;A. Kumar;R. Aspandiar
为了有效地迁移到无铅电子产品，该行业必须确定一些无铅兼容焊料，建立有效的组装工艺温度等级，并拥有大量与此热等级兼容的组件。在本文中，我们提出了无铅回流焊接的温度等级，讨论了开发最佳无铅回流曲线的关键因素，并确定了与无铅焊料相关的较高焊料温度兼容的封装所面临的挑战。我们还简要回顾了无铅材料的发展方向和挑战，用于焊球互连、元件端接和电路板表面处理。
For effective migration to lead-free electronics, the industry must identify a number of lead-free compatible solders, establish an effective assembly process temperature hierarchy, and have a large number of components that are compatible with this thermal hierarchy. In this paper, we propose a temperature hierarchy for lead-free reflow soldering, discuss the critical factors in developing an optimal lead-free reflow profile, and identify the challenges in making packages compatible with the higher solder temperatures associated with lead-free solders. We also briefly review the lead-free materials direction and challenges for solder ball interconnects, component termination and board finishes.