ENERGY CONVERSION IN HETEROSTRUCTURES FOR THERMIONIC COOLING

ENERGY CONVERSION IN HETEROSTRUCTURES FOR THERMIONIC COOLING
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用于热离子冷却的异质结构中的能量转换

DOI:
10.1080/108939500199628
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发表时间:
2000
期刊:
Microscale Thermophysical Engineering
影响因子:
--
通讯作者:
Tao Chen
Tao Chen
中科院分区:
--
文献类型:
--
作者:
Tao Chen

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基于热电子近似,研究了异质结中电子与声子之间的能量转换。本文根据物理性质的平均值,建立了一个分析模型来研究电子和声子的能量转移。在该模型中,电子导热,存款热的本地声子和获得能量的电场中的薄膜。在热的基底(阳极)中,电子迅速将能量输给声子。计算表明,这些异质结冷却器的性能系数较低(计算的情况下低于0.8),而冷侧和热侧之间的最大温差可能很高。为了具有高的性能系数,薄膜中电子和声子之间的能量交换率应该小,并且在衬底中应该大,以更好地排出膜中产生的热量。
The energy conversion between electrons and phonons in a heterostructure is studied for thermionic cooling based on the hot electron approximation. An analytical model is established to study the energy transfer of electrons and phonons on the basis of average values of physical properties. In the model, electrons conduct heat, deposit heat to the local phonons and gain energy from the electric field in the thin film. In the hot substrate (anode), electrons lose their energy quickly to the phonons. Calculations show that the coefficient of performance for those heterojunction coolers is low (below 0.8 for the cases calculated), while the maximum temperature difference between the cold side and the hot side can be high. In order to have a high coefficient of performance, the energy exchange rate between electrons and phonons in the thin film should be small, and it should be large in the substrate to better reject the heat generated in the film.