High Speed Thermal Imaging applied to a Long Pulse Resonant Converter Modulator for Power device Reliability Assessment
High Speed Thermal Imaging applied to a Long Pulse Resonant Converter Modulator for Power device Reliability Assessment
复制标题
高速热成像应用于长脉冲谐振转换器调制器，用于功率器件可靠性评估
DOI：
--
复制
发表时间：
2008
期刊：
影响因子：
--
通讯作者：
M. Bland
中科院分区：
文献类型：
--
作者：
F. Carastro;J. Clare;P. Wheeler;D. Cook;M. Musallam;M. Bland
本文讨论了一种用于射频电子管的调制器电源的设计。该电源基于串联谐振并联负载电源的直接调制。这项工作的主要目的是监测IGBT模块的半导体损耗，通过量热法和使用高速热成像的设备温度，在脉冲。本文概述了正在研究的试验台原型上使用的技术和设计。最后的实验台布局设计的内部器件的温度和损耗测量。这项工作的总体目标是确定所提出的调制器技术的局限性和可靠性。
This paper considers the design of a modulator supply for RF tube applications. The supply is based on direct modulation of a series resonant parallel loaded power supply. The main aim of this work is to monitor semiconductor losses of the IGBT modules through calorimetry and the device temperature using high speed thermal imaging, during the pulse. The paper provides an overview of the technology and design used on the test rig prototype under study. The final experimental rig layout designed for internal device temperature and loss measurement will be presented. The overall goal of the work is to identify the limitations and reliability of the modulator technology proposed.