Electroforming of oxide-nanoparticle-reinforced copper-matrix composite
Electroforming of oxide-nanoparticle-reinforced copper-matrix composite
复制标题
DOI：
10.1557/jmr.2014.401
复制
发表时间：
2015-02
影响因子：
2.7
通讯作者：
S. Semboshi;Y. Sakamoto;H. Inoue;A. Iwase;N. Masahashi
中科院分区：
文献类型：
--
作者：
S. Semboshi;Y. Sakamoto;H. Inoue;A. Iwase;N. Masahashi
提出了一种基于电铸技术的制备纳米颗粒增强铜基复合材料的方法，该方法使用的电解液为硫酸铜-硫酸溶液，其中含有1 cm^3/L的纳米颗粒，而不含表面活性剂。在所测试的Al_2O_3、SiO_2、TiO_2、ZrO_2和CeO_2纳米颗粒中，只有TiO_2纳米颗粒在电铸过程中由于其在电解液中带正电荷而成功地嵌入到铜基体中。应该注意的是，在铜基体中几乎没有污染，因为在电铸过程中不存在表面活性剂。因此，在含有纳米TiO_2的电解液中电铸的试样的电导率与纯铜的电导率没有显著差异。然而，硬度，屈服，和极限拉伸强度显着提高了少量（0.3mass%）的TiO_2纳米粒子主要是因为Orowan力学强化。因此，电铸工艺是一种很有前途的手段，以制备具有良好的导电性和机械强度的平衡的铜基复合材料。
A method based on the electroforming technique has been proposed for the fabrication of nanoparticle-reinforced copper-matrix composites using an electrolyte of copper sulfate–sulfuric acid solution containing 1 cm^3/L of the nanoparticles without surfactants. Of the tested nanoparticles such as Al_2O_3, SiO_2, TiO_2, ZrO_2, and CeO_2, whose sizes ranged from 10 to 30 nm, only TiO_2 nanoparticles were successfully embedded in the copper matrix during electroforming, owing to their positive charge in the electrolyte solution. It should be noted that there was very little contamination in the copper matrix, because surfactants were absent during electroforming. Therefore, the electrical conductivity of the specimen that was electroformed in the electrolytes with TiO_2 nanoparticles was not significantly different from that of pure copper. Nevertheless, the hardness, yield, and ultimate tensile strength were significantly improved by a small amount (0.3 mass%) of TiO_2 nanoparticles primarily because of strengthening by Orowan mechanics. The electroforming process is thus a promising means to prepare copper-matrix composites with an excellent balance of electrical conductivity and mechanical strengths.