Control of copper nanoparticle metallization on electrospun fibers via Pd and Ag seed-assisted templating
Control of copper nanoparticle metallization on electrospun fibers via Pd and Ag seed-assisted templating
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DOI：
10.1007/s10853-021-06326-x
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发表时间：
2021-07
影响因子：
4.5
通讯作者：
Temitope Q. Aminu;D. Bahr
中科院分区：
文献类型：
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作者：
Temitope Q. Aminu;D. Bahr
我们研究了钯和银的种子化学对在电纺聚丙烯腈(PAN)纤维上化学沉积纳米铜的影响，以确定能够形成保形涂层或孤立的金属纳米颗粒的条件。在晶种密度较高的情况下，铜在Pd籽晶纤维上的沉积动力学得到了增强，并实现了铜纳米颗粒与PAN纤维共形的连续生长。对于低密度的银种子，观察到铜纳米颗粒的离散分布。此外，高密度的Ag种子促进了致密致密的铜纳米颗粒薄膜，而Pd种子纤维上的薄膜粗糙，含有微孔夹杂物。拉曼光谱表明，在加工过程中形成的D带和G带的比例越高，表明在种子和沉积过程中表面PAN分子中的氰基环化程度越高，对应的种子密度就越高。PAN的热稳定性随着孤立的Pd种子的存在而增强，其中种子尺寸低于电子传导的平均自由程，但随着更大的种子或在纤维上形成更致密和致密的金属壳层而退化。
We investigated the effects of palladium and silver seed chemistries on the electroless deposition of copper nanoparticles on electrospun polyacrylonitrile (PAN) fibers to identify conditions that enable formation of either conformal coatings or isolated metallic nanoparticles. The kinetics of Cu deposition was enhanced on Pd seeded fibers over Ag seeding, and continuous growth of copper nanoparticles conformal to the PAN fibers was achieved in instances with high seed density for both seed chemistries. A discrete distribution of copper nanoparticles was observed for low density silver seeding. Furthermore, the high density Ag seeds promoted dense and compact copper nanoparticle films, while the films on the Pd seeded fibers were rough with inclusions of microporosity. Raman spectroscopy revealed that a higher ratio of the D to G bands formed during processing, indicative of more cyclization of nitrile groups in surface PAN molecules during the seeding and deposition processes, corresponds to a higher seeding density. Thermal stability of PAN is enhanced with isolated Pd seeds present where the seed size is lower than the mean free path for electron conduction, but degrades as larger seeds or more dense and compact metallic shells are formed on the fibers.Graphical abstract