Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass
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DOI：
10.1007/s11664-024-10962-9
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发表时间：
2024-02-28
影响因子：
2.1
通讯作者：
Searle，Justin
中科院分区：
文献类型：
--
作者：
Abbas，Bahaa;Jewell，Eifion;Searle，Justin
在丝网印刷电路的生产中使用微米铜和纳米银的混合物具有降低材料成本和成本可变性的潜力。本研究的基本前提是将银纳米颗粒以选定的比例分散在较大的铜微粒中，随后进行烧结，以确定其最终的电气和物理性能。将商业材料混合、印刷并在两种热制度下在氟掺杂的氧化锡（FTO）涂覆的玻璃基板上烧结。包含25%的银提供了电阻从4.21 Ω到0.93 Ω的明显降低，进一步添加银具有较小的影响。用于烧结的热状态对最终电性能具有次要影响。添加银降低了对FTO基底的粘附性，同时降低了膜完整性。结果表明，混合油墨具有提高材料导电性的优点，同时降低成本，使其成为电子制造领域探索和进步的引人注目的领域。
Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and subsequently sintering in order to establish their resultant electrical and physical performance. Commercial materials were mixed, printed, and sintered at two thermal regimes on fluorine-doped tin oxide (FTO)-coated glass substrate. The inclusion of 25% silver provided an appreciable reduction in electrical resistance from 4.21 Ω to 0.93 Ω, with further silver additions having less impact. The thermal regime used for sintering had a secondary impact on the final electrical performance. The addition of silver reduced the adhesion to the FTO substrate, with reduced film integrity. The results show that blending inks offers the advantage of enhancing material conductivity while simultaneously reducing costs, making it a compelling area for exploration and advancement in the field of electronics manufacturing.