Deposition and phase transformation behaviors of Ti-Ni-Hf-Cu quaternary shape memory alloy thin films
Deposition and phase transformation behaviors of Ti-Ni-Hf-Cu quaternary shape memory alloy thin films
复制标题
Ti-Ni-Hf-Cu四元形状记忆合金薄膜的沉积及相变行为
DOI：
10.1016/j.jallcom.2019.07.238
复制
发表时间：
2019
影响因子：
6.2
通讯作者：
Zhao Liancheng
中科院分区：
文献类型：
--
作者：
Li Jun;Yi Xiaoyang;Meng Xianglong;Qiao Shi;Cai Wei;Zhao Liancheng
In the present study, Ti–Ni-Hf-Cu thin films were successfully fabricated by magnetron sputtering process. Moreover, the effects of various factors on the quality of Ti–Ni-Hf-Cu thin film were investigated and the optimal processing parameters were determined. The results reveal that the composition and quality of Ti–Ni-Hf-Cu thin film can be mainly tailored by changing the sputtering power and Ar pressure. The amorphous Ti–Ni-Hf-Cu thin films with the high-quality can be obtained at the following condition: sputtering power = 150 W; Ar pressure = 0.6 Pa; sputtering time = 6 h. The annealed Ti–Ni-Hf-Cu thin film consisted of monoclinic B19′ martensite phase and nano-scale (Ti,Hf)2Ni type precipitate. Compared with the bulk Ti–Ni-Hf-Cu alloy, the annealed Ti–Ni-Hf-Cu thin film showed the lower martensitic transformation temperature. Nevertheless, the forward martensitic transformation starting temperature of the annealed Ti–Ni-Hf-Cu thin film was still higher than 100 °C, which can meet the requirement of the high temperature application field.
