Hot deformation behavior of Cu-bearing antibacterial titanium alloy
Hot deformation behavior of Cu-bearing antibacterial titanium alloy
复制标题
含Cu抗菌钛合金的热变形行为
DOI：
10.1016/j.jmst.2017.12.015
复制
发表时间：
2018-10-01
影响因子：
10.9
通讯作者：
Yang, Ke
中科院分区：
文献类型：
--
作者：
Ma, Zheng;Ren, Ling;Yang, Ke
研究了一种新型医用含铜钛合金Ti-645（Ti-6.06Al-3.75V-4.85Cu，wt%）的变形行为，以优化其组织控制和热加工工艺。结果表明，Ti-645合金的真应力-真应变曲线对变形温度和应变速率都很敏感。随着变形温度的升高，Ti-645合金的显微组织由等轴晶向针状晶转变，晶粒尺寸显著减小。Ti-645合金在热压缩过程中存在明显的动态回复（DRV）和动态再结晶（DRX）。计算出（α + β）相区和β单相区的表观活化能分别为495.21 kJ mol（-1）和195.69 kJ mol（-1）。加工图显示该合金具有大的热加工区域，而最佳窗口出现在0.001-0.1 s（-1）的应变速率范围内，温度范围为900-960 ℃和1000-1050 ℃。研究结果可为Ti-645合金的热加工工艺设计提供工艺依据，优化材料设计，拓宽Ti-645合金的临床应用前景。(C)2018由Elsevier Ltd代表Journal of Materials Science & Technology编辑部出版。
We investigated the deformation behavior of a new biomedical Cu-bearing titanium alloy (Ti-645 (Ti-6.06Al-3.75V-4.85Cu, in wt%)) to optimize its microstructure control and the hot-working process. The results showed that true stress-true strain curve of Ti-645 alloy was susceptible to both deformation temperature and strain rate. The microstructure of Ti-645 alloy was significantly changed from equiaxed grain to acicular one with the deformation temperature while a notable decrease in grain size was recorded as well. Dynamic recovery (DRV) and dynamic recrystallization (DRX) obviously existed during the thermal compression of Ti-645 alloy. The apparent activation energies in (alpha + beta) phase and beta single phase regions were calculated to be 495.21 kJ mol(-1) and 195.69 kJ mol(-1), respectively. The processing map showed that the alloy had a large hot-working region whereas the optimum window occurred in the strain rate range of 0.001-0.1 s(-1), and temperature range of 900-960 degrees C and 1000-1050 degrees C. The obtained results could provide a technological basis for the design of hot working procedure of Ti-645 alloy to optimize the material design and widen the potential application of Ti-645 alloy in clinic. (C) 2018 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.