A case for 2-body material removal in prime LED sapphire substrate lapping and polishing
A case for 2-body material removal in prime LED sapphire substrate lapping and polishing
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DOI：
10.1016/j.jmapro.2012.11.005
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发表时间：
2013-01-01
影响因子：
6.2
通讯作者：
Zhang, Harry
中科院分区：
文献类型：
--
作者：
Gagliardi, John J.;Kim, Don;Zhang, Harry
提出了一种可能更好的替代方法来处理主LED蓝宝石晶圆。材料去除机制的简史表明，脆性材料可以在延性状态下被磨损，这可能是一种优越的去除模式。与三体材料去除相比，蓝宝石二体韧性去除在材料去除率、表面光洁度和亚表面损伤方面具有优势。这种方法的一个主要困难可能是让LED制造业理解蓝宝石表面的外观是完全不同的，不熟悉但可预测。最后，讨论了一些利用二体材料去除的潜在替代工艺方法。(C) 2012制造工程师学会。Elsevier Ltd.出版。版权所有。
An alternative, and potentially better, means to process prime LED sapphire wafers is proposed. A brief history of material removal mechanisms suggests that brittle materials can be abraded in a ductile regime and that this can be a superior mode of removal. Advantages in material removal rate, surface finish and subsurface damage for a 2-body ductile removal of sapphire are shown relative to 3-body material removal. A major difficulty with this approach may be getting the LED manufacturing industry to understand that the appearance of the sapphire surface is quite different, unfamiliar yet predictable. Finally, some potential alternative process approaches are discussed that utilize 2-body material removal. (C) 2012 The Society of Manufacturing Engineers. Published by Elsevier Ltd. All rights reserved.