PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
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分层和异构 2.5D 多芯片电源模块的 PowerSynth 设计自动化流程
DOI：
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发表时间：
2021
影响因子：
6.7
通讯作者：
Yarui Peng
中科院分区：
文献类型：
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作者：
Imam Al Razi;Quang Le;Tristan M. Evans;Shilpi Mukherjee;H. Mantooth;Yarui Peng
作为关键的能量转换系统部件，功率半导体模块及其布局优化已经被确定为实现宽带隙技术的最大性能和密度（即，GaN和SiC）。还引入了新的封装技术，以生产可靠和高效的多芯片电源模块（MCPM）设计，以推动电流限制。MCPM布局的复杂性正在超越手动迭代设计过程的能力，以产生具有敏捷开发需求的最佳设计。电子设计自动化工具PowerSynth已经推出，并正在进行研究，以增强功能，加快优化的MCPM布局设计过程。作为这项持续研究的一部分，在PowerSynth v1.9中，开发了一个约束感知的布局引擎，它可以集成异构组件，处理复杂的几何形状，探索更大的解决方案空间，提高成功率，并为多目标优化算法提供选项。布局引擎是通用的、可扩展的，并且在2-D和2.5-D功率模块上执行电热优化是高效的。为了验证这些增强的设计能力，2.5-D全桥功率模块布局的设计，优化，制造和测试的测量结果与模型预测密切匹配。该结果通过实验验证的模块设计自动化流程关闭了电力电子设计过程中的循环。
As a critical energy-conversion system component, power semiconductor modules and their layout optimization has been identified as a crucial step in achieving the maximum performance and density for wide bandgap technologies (i.e., GaN and SiC). New packaging technologies are also introduced to produce reliable and efficient multichip power module (MCPM) designs to push the current limits. The complexity of the MCPM layout is surpassing the capability of a manual, iterative design process to produce an optimum design with agile development requirements. An electronic design automation tool called PowerSynth has been introduced with on-going research toward enhanced capabilities to speed up the optimized MCPM layout design process. As a part of this continuing research, in PowerSynth v1.9, a constraint-aware layout engine has been developed, which enables integrating heterogeneous components, handling complex geometry, exploring a larger solution space, improved success rate, and providing options for multiobjective optimization algorithms. The layout engine is generic, scalable, and efficient in performing electro-thermal optimizations on both 2-D and 2.5-D power modules. To validate these enhanced design capabilities, a 2.5-D full-bridge power module layout is designed, optimized, fabricated, and tested with measurement results matching closely with model prediction. This result closes the loop in the power electronics design process with an experimentally validated module design automation flow.