Optimizing Parylene C Adhesion for MEMS Processes: Potassium Hydroxide Wet Etching
Optimizing Parylene C Adhesion for MEMS Processes: Potassium Hydroxide Wet Etching
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DOI：
10.1109/jmems.2013.2248126
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发表时间：
2013-08-01
影响因子：
2.7
通讯作者：
Keppner, Herbert
中科院分区：
文献类型：
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作者：
Charmet, Jerome;Bitterli, Joanna;Keppner, Herbert
聚对二甲苯用于微机电系统（MEMS）装置中的广泛应用。然而，它们在苛刻的液体环境中的差的粘附性可能限制复杂MEMS和bioMEMS器件的制造工艺。氢氧化钾（KOH）湿法蚀刻特别具有挑战性，并用于评估聚对二甲苯C在硅、氮化硅和二氧化硅基材上的附着力。使用一些表征程序，本文表明，分层是液体渗透在聚对二甲苯-基板界面和通过聚合物层的结果。粘合促进剂和热处理的组合改善了层的粘合性。在两个案例研究中对治疗进行了评价，其中Parylene用作：1）生物相容性涂层，2）作为掩模以阻挡微流体通道的入口。在第一种情况下，与一般的聚对二甲苯层相比，显示了包括KOH暴露的处理不影响SaOS-2细胞的生长和增殖。在第二种情况下，结果表明，聚对二甲苯可以有效地用于阻塞通道的入口，并且它可以在之后被去除。[2012-0267]
Parylenes are used for a wide range of applications in microelectromechanical systems (MEMS) devices. However, their poor adhesion in a harsh liquid environment can limit the fabrication processes of complex MEMS and bioMEMS devices. Potassium hydroxide (KOH) wet etching is particularly challenging and was used to evaluate the adhesion of Parylene C on silicon, silicon nitride, and silicon dioxide substrates. Using a number of characterization procedures, this paper shows that the delamination is the result of liquid penetrating both at the Parylene-substrate interface and through the polymer layer. The combination of an adhesion promoter and a thermal treatment improves the adhesion of the layer. The treatment is evaluated in two case studies, where the Parylene is used as: 1) a biocompatible coating, and 2) as a mask to block the entrance of a microfluidics channel. In the first case, it is shown that the treatments, including the KOH exposure, do not influence the growth and proliferation of SaOS-2 cells, as compared to a generic Parylene layer. In the second case, the results show that Parylene can be used efficiently to block the entrance of the channel, and that it can be removed afterward. [2012-0267]