Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates
Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates
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DOI：
10.1007/s11664-007-0255-9
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发表时间：
2007-09
影响因子：
2.1
通讯作者：
Ching-feng Yang;Sinn-wen Chen;K. Wu;T. Chin
中科院分区：
文献类型：
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作者：
Ching-feng Yang;Sinn-wen Chen;K. Wu;T. Chin
锡锌铋合金是很有前途的无铅焊料。sn -8wt、%Zn-3wt之间的界面反应。研究了%Bi （Sn-13.80at.%Zn-1.62at.%Bi）合金和Cu、Ag、Ni基体。使用两种不同的衬底，大块板和电镀层，反应在250℃和220℃下进行。虽然锌含量只有13.8 at。在Sn-13.80at.%Zn-1.62at中，形成γ- cu5zn8和ε- cuzn5相的Zn-Cu化合物。% Bi /铜夫妇。ε- cuzn5相呈扇贝状，γ- cu5zn8相呈平面状。在Sn-13.80at.%Zn-1.62at。发现了3种Zn-Ag化合物，分别为ε-AgZn3、γ-Ag5Zn8和ζ-AgZn相。在Sn-13.80at.%Zn-1.62at。%Bi/Ni偶形成Zn-Ni化合物γ- ni5zn21相。用电镀层制备的电偶也有类似的结果：反应相相同，但生长速率不同。
Sn-Zn-Bi alloys are promising Pb-free solders. Interfacial reactions between the Sn-8wt.%Zn-3wt.%Bi (Sn-13.80at.%Zn-1.62at.%Bi) alloy and the Cu, Ag, and Ni substrates are examined. Two different kinds of substrates, the bulk plate and the electroplating layer, are used, and the reactions are carried out at 250°C and 220°C. Although the Zn content is only 13.8 at.%, two Zn-Cu compounds, γ-Cu5Zn8and ε-CuZn5phases, are formed in the Sn-13.80at.%Zn-1.62at.%Bi/Cu couples. The ε-CuZn5phase is scallop shaped, and the γ-Cu5Zn8phase is planar. In the Sn-13.80at.%Zn-1.62at.%Bi/Ag couples, three Zn-Ag compounds are observed, and they are ε-AgZn3, γ-Ag5Zn8, and ζ-AgZn phases. In the Sn-13.80at.%Zn-1.62at.%Bi/Ni couples, a Zn-Ni compound, γ-Ni5Zn21phase, is formed. Similar results are found in the couples prepared with an electroplating layer: the reaction phases are the same, but the growth rates are different.