Study on Laser Micro Shock Effect on Electrical Resistivity of Nanometer Copper Film
Study on Laser Micro Shock Effect on Electrical Resistivity of Nanometer Copper Film
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DOI：
10.4028/www.scientific.net/amr.989-994.45
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发表时间：
2014-07
期刊：
影响因子：
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通讯作者：
Q. Xue;Y. Hua;Y. Bai;R. Chen;H. Liu
中科院分区：
文献类型：
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作者：
Q. Xue;Y. Hua;Y. Bai;R. Chen;H. Liu
本研究的目的是通过激光微冲击加工来提高纳米铜薄膜的电性能。采用磁控溅射法制备纳米铜薄膜。研究了激光微冲击加工对电阻率、硬度和弹性模量影响的机理。结果表明，激光微冲击后铜膜的电阻率平均降低了22.5%。并且，硬度和弹性模量平均分别增加了38.5%和45.2%。根据我们的研究，我们得出结论：大量孪晶、孪晶界、断层和长大晶粒的存在是电性能提高的主要因素；而孪晶、应力集中孔洞和断层的存在是提高其力学性能的关键。
The aim of this research is to improve the electrical performance of the nanometer copper film by laser micro shock processing. The nanometer copper film was prepared by the magnetron sputtering. The mechanism of laser micro shock processing effect on electrical resistivity, hardness and elastic modulus was investigated. The results show that the electrical resistivity of copper film after laser micro shock reduced by 22.5 % on average. And, the hardness and the elastic modulus increased by 38.5 % and 45.2 % on average, respectively. According to our research, we conclude that, the existence of a large number of twin, twin boundary, fault and the grow up grain are the main factor of the improvement of the electrical performance; and the existence of twin, stress concentration holes and fault are the key to improve its mechanical properties.