High-temperature electron backscatter diffraction and scanning electron microscopy imaging techniques: in-situ investigations of dynamic processes.
High-temperature electron backscatter diffraction and scanning electron microscopy imaging techniques: in-situ investigations of dynamic processes.
复制标题
高温电子背散射衍射和扫描电子显微镜成像技术：动态过程的原位研究。
作者：
Gareth Seward;D. J. Prior;John Wheeler;S. Celotto;D. Halliday;R. Paden;M. Tye
原位加热实验已经进行了约1200 K的温度下，利用一种新的设计的扫描电子显微镜，CamScan X500。X500的设计旨在优化电子背散射衍射（EBSD）分析的潜力，同时进行原位加热实验。新设计的特点包括一个倾斜的场发射枪（FEG）列，它提供了EBSD的几何要求的入射电子束和试样表面之间的高（通常为160度）的角度，但避免了复杂的加热阶段的设计和操作，保持在水平方向。我们的研究发现，二次电子和取向衬度成像已成为可能的各种试样材料的温度至少为900摄氏度，而没有显着的成像质量下降。电子背散射衍射图案已经在至少900摄氏度的温度下获得，并且具有足够的质量以允许自动数据收集。在200摄氏度和700摄氏度之间的温度下，在铝、黄铜、镍、钢、石英和方解石中，甚至在890摄氏度以上的温度下，在纯钛中，已经产生了自动EBSD图。扫描电子显微镜成像技术和EBSD分析与高温原位实验相结合，是观察金属，半导体材料和陶瓷中动态晶体学和微观结构过程的有力工具。
In-situ heating experiments have been conducted at temperatures of approximately 1200 K utilising a new design of scanning electron microscope, the CamScan X500. The X500 has been designed to optimise the potential for electron backscatter diffraction (EBSD) analysis with concomitant in-situ heating experimentation. Features of the new design include an inclined field emission gun (FEG) column, which affords the EBSD geometrical requirement of a high (typically 160 degrees) angle between the incoming electron beam and specimen surface, but avoids complications in heating-stage design and operation by maintaining it in a horizontal orientation. Our studies have found that secondary electron and orientation contrast imaging has been possible for a variety of specimen materials up to a temperature of at least 900 degrees C, without significant degradation of imaging quality. Electron backscatter diffraction patterns have been acquired at temperatures of at least 900 degrees C and are of sufficient quality to allow automated data collection. Automated EBSD maps have been produced at temperatures between 200 degrees C and 700 degrees C in aluminium, brass, nickel, steel, quartz, and calcite, and even at temperatures >890 degrees C in pure titanium. The combination of scanning electron microscope imaging techniques and EBSD analysis with high-temperature in-situ experiments is a powerful tool for the observation of dynamic crystallographic and microstructural processes in metals, semiconductor materials, and ceramics.