Functional characterisation of high frequency arrays based on micro-moulded 1–3 piezocomposites

Functional characterisation of high frequency arrays based on micro-moulded 1–3 piezocomposites
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基于微模制 1-3 压电复合材料的高频阵列的功能表征

DOI:
10.1109/ultsym.2009.5441966
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发表时间:
2009
期刊:
2009 IEEE International Ultrasonics Symposium
影响因子:
--
通讯作者:
J. Bamber
J. Bamber
中科院分区:
--
文献类型:
--
作者:
C. Démoré;A. Bernassau;D. Hutson;S. Cochran;L. Garcia;F. Dauchy;C. Meggs;T. Button;N. Bush;J. Bamber

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临床上需要高频超声阵列,其与当前在实时高分辨率成像系统中使用的单元件换能器相比可以提供改进的图像质量。基于精细尺度压电复合材料的微型阵列需要足够灵敏的成像系统。在本文中,我们报告的原型线阵适合高频成像的制造和功能特性。阵列电极已被图案化的微成型的1-3压电复合材料的表面上的工艺比可以缩放的线性阵列在100 MHz下工作。50 µm和15 µm间距阵列的功能测试证明了这种方法的可行性。
A clinical need exists for high frequency ultrasound arrays that can provide improved image quality compared to the single-element transducers currently used in real-time high resolution imaging systems. Miniature arrays based on fine-scale piezocomposites are required for sufficiently sensitive imaging systems. In this paper we report fabrication and functional characterization of prototype linear arrays suitable for high frequency imaging. Array electrodes have been patterned photolithographically on the surface of micro-moulded 1–3 piezocomposites with processes than can be scaled for linear arrays operating at 100 MHz. Functional testing of arrays with 50 µm and 15 µm pitch demonstrates feasibility of this approach.