On Concepts and Challenges of Realizing Material‐Integrated Intelligent Systems
On Concepts and Challenges of Realizing Material‐Integrated Intelligent Systems
复制标题
论实现材料集成智能系统的概念和挑战
DOI：
10.1002/9783527679249.ch1
复制
发表时间：
2017
期刊：
影响因子：
5.6
通讯作者：
D. Lehmhus
中科院分区：
文献类型：
--
作者：
S. Bosse;D. Lehmhus
本导言概述了本书中讨论的关键概念。这本书建议，材料集成传感的实施可以遵循自上而下或自下而上的方法。基于材料集成智能系统的产品会增加产品开发的复杂性。本书从智能系统设计的角度讨论了全球范围内的设计方法。还讨论了传感器技术和材料集成。本书介绍了将传感器集成到纤维增强聚合物、金属板和通过增材制造技术生产的结构中的解决方案。它概述了传感器节点的不同组件的原理以及将传感器节点集成到材料和机械结构中的挑战。这本书提出的问题，在哪里，在哪些行业和特定的目的，材料集成的智能系统可以预期看到商业化。
This introduction presents an overview of the key concepts discussed in this book. The book suggests that the implementation of material‐integrated sensing can either follow a top‐down or a bottom‐up approach. Basing a product on material‐integrated intelligent systems leads to increased complexity in product development. The book discusses the design methodologies on a global level and from the point of view of smart system design. It also discusses the sensor technologies and material integration. The book explains the solutions for incorporation of sensors in fiber‐reinforced polymers, sheet metal, and structures produced via additive manufacturing techniques. It outlines the principles of different components of a sensor node and the challenges to integrate sensor nodes in materials and mechanical structures. The book presents the question of where, in which industries and for which specific purposes, material‐integrated intelligent systems can be expected to see commercialization.
DOI：
10.1098/rspa.2007.1834
发表时间：
2007-06
期刊：
Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences
影响因子：
--
作者：
K. Worden;C. Farrar;G. Manson;G. Park
通讯作者：
K. Worden;C. Farrar;G. Manson;G. Park