Statistical analysis of crosstalk-induced errors for on-chip interconnects
Statistical analysis of crosstalk-induced errors for on-chip interconnects
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DOI：
10.1049/iet-cdt.2009.0054
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发表时间：
2011-03
期刊：
影响因子：
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通讯作者：
Basel Halak;A. Yakovlev
中科院分区：
文献类型：
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作者：
Basel Halak;A. Yakovlev
研究了参数变化时串扰噪声对片上通信链路弹性的影响。开发了一种称为串扰错误率的新颖指标，它可以成为设计人员预测串扰效应和探索互连设计技术的宝贵工具，以便以最小的开销实现目标性能。给出了串扰错误率的封闭式表达式。该指标用于比较 90 nm 技术中的不同串扰避免方法。
The impact of crosstalk noise on the resilience of on-chip communication links in the presence of parametric variations is investigated. A novel metric called crosstalk error rate is developed which can be a valuable tool for designers to predict the crosstalk effects and explore interconnect design techniques in order to achieve the target performance with minimum overheads. Closed-form expressions of crosstalk error rate are presented. This metric is used to compare different crosstalk avoidance methods in the 90 nm technology.