A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress
A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress
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适用于电子冷却的紧凑型风冷散热器快速概述——最新进展
DOI：
10.3390/inventions2010005
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发表时间：
2017
期刊：
影响因子：
--
通讯作者：
Chi
中科院分区：
文献类型：
--
作者：
Chi
本研究提供了一个概述有关增强适用于电子冷却的空气冷却散热器受横流强制对流。讨论了风冷散热器的一些新设计及其相关问题，包括附加表面的缺点，多孔表面（如泡沫金属或泡沫碳）的使用，高度间断表面（缝隙或狭缝）和纵向涡发生器的问题和适用范围。虽然金属泡沫可以容纳显著的表面积，但是由于其低得多的翅片效率，其对于空气冷却应用是相对无效的，并且该缺点可以通过与实心翅片集成来改善。对于高密度的鳍片间距（例如，<1.0 mm），沟槽或沟槽表面可能是更好的选择，而周期性收缩和膨胀的翅片结构可能不适合，因为它引入了额外的压降损失。部分旁路的概念，它操纵一个更大的温差在尾部的散热器，可以实施显着降低压降。通过一定的小生境操作，部分旁路热沉的热阻可能上级常规热沉。梯形翅片表面具有更容易制造和更小的重量被示出具有竞争力的性能对传统的矩形翅片几何形状。IPFM（Interleaved Atelogram Fin Module）设计结合了两种不同的几何形状的散热片，奇数散热片为矩形，偶数散热片为矩形，比传统设计少8%-12%的表面，但在低流量操作中仍然提供比传统矩形散热器更低的热阻。与传统的板翅结构相比，横切口结构的散热性能有了明显的提高，尤其是在高速区，而且单横切口散热器比多横切口散热器具有上级优势。
This study provides an overview regarding enhancement of an air-cooled heat sink applicable for electronic cooling subject to cross-flow forced convection. Some novel designs and associated problems in air-cooled heat sinks are discussed, including the drawback of adding surfaces, utilization of porous surfaces such as metal foam or carbon foam, problems and suitable applicable range of highly interrupted surfaces (louver or slit) and longitudinal vortex generator. Though the metal foam may accommodate significant surface area, it is comparatively ineffective for air-cooling application due to its much lower fin efficiency, and this shortcoming can be improved by integrating with solid fin. For highly dense fin spacing (e.g., <1.0 mm), cannelure or grooved surface may be a better choice, and fin structure with periodic contraction and expansion may not be suitable for it introduces additional pressure drop penalty. The partial bypass concept, which manipulates a larger temperature difference at the trailing part of heat sink, can be implemented to significantly reduce the pressure drop. Through some certain niche operation, t the thermal resistance of the partial bypass heat sink may be superior to the conventional heat sink. The trapezoid fin surface featuring easier manufacturing and a smaller weight is shown to have competitive performance against traditional rectangular fin geometry. The IPFM (Interleaved Parallelogram Fin Module) design which combines two different geometrical fins with the odd number fins being rectangular shape, and parallelogram shape in even fin numbers, shows 8%–12% less surface than conventional design but still offers a lower thermal resistance than the conventional rectangular heat sink in lower flowrate operation. The cross-cut design shows appreciable improvements as compared to the conventional plate fin design especially in high velocity regime and the single cross-cut heat sinks are superior to multiple cross-cut heat sinks.
湍流传输的控制-更少的摩擦和更多的传热-
DOI：
--
发表时间：
2011
期刊：
ASME Journal of Heat Transfer
影响因子：
--
作者：
Kasagi N.;Hasegawa Y.;Fukagata K.;Iwamoto K.
通讯作者：
Iwamoto K.