An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life
An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life
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通过遗传算法研究 PWB 布局以最大化疲劳寿命
DOI：
10.1115/1.2792658
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发表时间：
1999
影响因子：
1.6
通讯作者：
B. Bras
中科院分区：
文献类型：
--
作者：
A. Scholand;R. Fulton;B. Bras
随着封装限制的缩小和功率使用的增加，印刷线路板（PWB）组件中的热考虑变得越来越重要。在本文中，我们提供了一个遗传算法驱动的PWB布局设计工具，以提高这种组件的热性能的潜力的研究。作为一个案例研究，热机械疲劳的表面贴装无引线芯片载体上的FR4环氧树脂板。我们已经发现，通过利用适当的基于公式的工程近似，遗传算法在寻找接近最优和最优的结果的效率，使这种方法有效的探索性的“侦察”方法，以确定有前途的板配置计算更昂贵的评估，如有限元法。
Thermal considerations in Printed Wiring Board (PWB) assemblies are becoming increasingly important as packaging constraints shrink and power use escalates. In this paper, we provide a study on the potential for a Genetic Algorithm-driven PWB layout design tool to improve the thermal performance of such assemblies. As a case study, the thermo-mechanical fatigue of surface mounted leadless chip carriers on an FR4 epoxy board is used. We have found that by utilizing appropriate formulabased engineering approximations, the efficiency of Genetic Algorithms in finding near-optimal and optimal results makes this approach effective as an explorative 'scouting' approach to identify promising board configurations for more computationally expensive evaluations such as finite element method.