Low-Temperature Formation of Large-Grain (≧10μm) Ge at Controlled-Position on Insulator by Gold-Induced Crystallization Combined with Diffusion-Barrier Patterning
Low-Temperature Formation of Large-Grain (≧10μm) Ge at Controlled-Position on Insulator by Gold-Induced Crystallization Combined with Diffusion-Barrier Patterning
复制标题
金诱导结晶结合扩散势垒图案化在绝缘体上受控位置低温形成大晶粒(≥10μm)Ge
DOI:
10.1149/2.0161603jss
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发表时间:
2016
影响因子:
2.2
通讯作者:
and T. Sadoh
中科院分区:
文献类型:
--
作者:
R. Aoki;Jong-Hyeok Park;M. Miyao;and T. Sadoh
Formation of position-controlled large-grain (≥ 10 μm) Ge crystals on insulator is realized at low-temperature (300 C) by gold-induced-crystallization using a-Ge/Au stacked structures. By introduction of diffusion barriers, ie, thin-Al 2 O 3 layers (2 nm thickness), having open-windows (3–20 μm diameter) into the a-Ge/Au interfaces, Ge crystals are selectively grown from the open windows. For open-windows with diameter of 20 μm, the grown areas consist of several Ge (111) grains. This is attributed to that several nuclei acting as seed are generated around the perimeters of the open windows. The number of seeds is linearly decreased by decreasing of the open-window diameter. As a result,(111)-oriented large (∼ 10 μm) Ge single-crystals, without any grain boundary, are obtained at controlled positions for open-windows with diameter of 3 μm. This technique will facilitate realization of flexible electronics and 3-dimensional large-scale integrated circuits, where Ge-based functional high-performance thin-film devices are integrated on flexible plastic substrates and/or amorphous insulating layers.