META-BROMOBIPHENOL EPOXY-RESINS - APPLICATIONS IN ELECTRONIC PACKAGING AND PRINTED-CIRCUIT BOARD
META-BROMOBIPHENOL EPOXY-RESINS - APPLICATIONS IN ELECTRONIC PACKAGING AND PRINTED-CIRCUIT BOARD
复制标题
DOI：
10.1002/app.1991.070430713
复制
发表时间：
1991-10-05
影响因子：
3
通讯作者：
MENDOZA, A
中科院分区：
文献类型：
--
作者：
WANG, CS;BERMAN, JR;MENDOZA, A
合成了一种新型2，2‘，6，6’-tetrabromo-3，3‘，5，5’-tetramethyl-4，4‘-biphenol及其环氧衍生物，将稳定的间溴化苯酚部分引入到环氧树脂体系中。在电子封装和层压应用中，与传统的邻溴环氧树脂相比，由TBTMBP衍生的环氧树脂体系表现出更好的水解性和热稳定性。这些特性延长了半导体的器件寿命，并为印刷电路板带来了高T(G)，同时还满足了阻燃要求。
Novel 2,2',6,6'-tetrabromo-3,3',5,5'-tetramethyl-4,4'-biphenol (TBTMBP), and its epoxy derivatives, were synthesized to incorporate the stable meta-brominated phenol moiety into epoxy resin systems. In electronic encapsulation and laminate applications, epoxy systems derived from TBTMBP have exhibited superior hydrolytic and thermal stability as compared with the conventional ortho-brominated epoxy resins. These properties have resulted in an extended device life for semiconductors and a high T(g) with excellent blister resistance for the printed circuit board, while meeting flame retardancy requirements as well.