The Edge Roll Off Generation Mechanism in Polishing by Considering the Viscoelasticity of Polishing Pads
The Edge Roll Off Generation Mechanism in Polishing by Considering the Viscoelasticity of Polishing Pads
复制标题
考虑抛光垫粘弹性的抛光中边缘滚落产生机制
DOI：
10.1115/msec2009-84063
复制
发表时间：
2009
期刊：
影响因子：
--
通讯作者：
K. Hirose
中科院分区：
文献类型：
--
作者：
T. Miyake;T. Enomoto;K. Hirose
近年来，镜面精加工对工件边缘形状的平面度要求越来越高。特别地，在抛光工艺中要求减少作为半导体器件的衬底的硅晶片的边缘滚降，以提高IC芯片的产量。人们已经对边缘滚降的产生进行了大量的理论和实验分析，并提出了抑制滚降的抛光方法。然而，这些分析不能完全解释在实际抛光中获得的边缘形状，并且关于滚降的问题仍然存在。在这项研究中，边缘滚降的产生机制的基础上的粘弹性抛光垫的新提出。该机构考虑了工件与垫座之间的水平和垂直方向的相对静、动态运动。此外，非接触式粘弹性测量仪最初是为了精确评估抛光垫的粘弹性而开发的。一系列硅晶片抛光实验表明，由边缘滚降产生机制和测量的抛光垫粘弹性引起的边缘形状与获得的边缘形状吻合良好。Copyright © 2009 by ASME
Recently, the achievement of further high flatness of workpiece edge shape is strongly required in mirror finishing. Especially, the edge roll off of silicon wafers as the substrates of semiconductor devices is demanded to decrease in the polishing process for raising the yield of IC chips. Many theoretical and experimental analyses of the edge roll off generation have been already done and the polishing methods for suppressing the roll off have been proposed to meet the demand. The analyses, however, cannot fully account for the obtained edge shape in actual polishing and the problem about the roll off remains. In this study, the generation mechanism of the edge roll off based on the viscoelasticity of polishing pad was newly proposed. The mechanism considered the horizontal and vertical relative static and dynamic motion between the pad and the workpiece. Moreover, the non-contact viscoelasticity measurement instrument was originally developed to evaluate the viscoelasticity of the polishing pad precisely. A series of polishing experiments for silicon wafers revealed that the edge shape, which was induced from the edge roll off generation mechanism and the measured viscoelasticity of the polishing pad, corresponded well with the obtained edge shape.Copyright © 2009 by ASME