Impact of ion energy on single-event upset

Impact of ion energy on single-event upset
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离子能量对单粒子翻转的影响

DOI:
10.1109/23.736489
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发表时间:
1998
影响因子:
1.8
通讯作者:
P. Winokur
P. Winokur
中科院分区:
工程技术3区
文献类型:
--
作者:
P. Dodd;O. Musseau;M. Shaneyfelt;F. Sexton;C. D'hose;G. L. Hash;M. Martinez;R. A. Loemker;J. Leray;P. Winokur

文献摘要

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用低能和高能重离子辐照CMOS SRAM,研究了离子能量对单粒子翻转的影响。研究了各种CMOS SRAM技术,栅极长度范围从1到0.5 μ/m,集成密度从16 Kbit到1 Mbit。在低能量和高能量的单事件不安反应之间没有观察到显著差异。结果是一致的模拟重离子的轨道结构,显示中心的轨道结构的前几乎是相同的低,高能量离子。三维模拟证实,在这两种情况下,电荷收集是相似的。标准的低能重离子测试更具成本效益,似乎足以满足CMOS技术低至0.5 /spl mu/m的要求。我们讨论深亚微米尺度,多位翻转,和硬度保证的影响。
The impact of ion energy on single-event upset was investigated by irradiating CMOS SRAMs with low and high-energy heavy ions. A variety of CMOS SRAM technologies was studied, with gate lengths ranging from 1 to 0.5 /spl mu/m and integration densities from 16 Kbit to 1 Mbit. No significant differences were observed between the low and high-energy single-event upset response. The results are consistent with simulations of heavy-ion track structures that show the central fore of the track structures are nearly identical for low and high-energy ions. Three-dimensional simulations confirm that charge collection is similar in the two cases. Standard low-energy heavy ion tests are more cost-effective and appear to be sufficient for CMOS technologies down to 0.5 /spl mu/m. We discuss implications for deep submicron scaling, multiple-bit upsets, and hardness assurance.