Enhanced properties of tungsten films by high-power impulse magnetron sputtering
Enhanced properties of tungsten films by high-power impulse magnetron sputtering
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高功率脉冲磁控溅射提升钨薄膜性能
DOI：
10.1016/j.surfcoat.2019.02.055
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发表时间：
2019-04-15
影响因子：
5.4
通讯作者：
Wang, Y. M.
中科院分区：
文献类型：
--
作者：
Engwall, A. M.;Shin, S. J.;Wang, Y. M.
研究了高功率脉冲磁控溅射（HiPIMS）沉积钨薄膜（750-1200 nm）在不同溅射气压和衬底偏压下的物理和微结构特性。与具有相同沉积配置和类似参数的通过传统直流（DC）方法沉积的膜相比，HiPIMS材料表现出更高的硬度、更光滑的表面和更好的对基底的粘附性。这些优异的性能归因于在HiPIMS沉积过程中形成的高度均匀的晶粒结构，与DC溅射膜中看到的漏斗形晶粒形成对比。结合原位应力测量，我们讨论了导致HiPIMS钨薄膜性能增强的潜在机制。
Tungsten films (750-1200 nm thick) deposited by high-power impulse magnetron sputtering (HiPIMS) under various sputtering gas pressure and substrate bias are investigated for their physical and microstructural characteristics. Compared to films deposited by the traditional direct current (DC) method with the same deposition configuration and similar parameters, HiPIMS materials exhibit higher hardness, a smoother surface, and better adhesion to a substrate. These excellent properties are attributed to the highly uniform grain structures developed during HiPIMS deposition, in contrast to the funnel shaped grains seen in DC sputtered films. Combined with the in-situ stress measurements, we discuss the underlying mechanisms that lead to enhanced properties of HiPIMS tungsten films.