The Ultra Clean Sputtering Process And High Density Magnetic Recording Media
The Ultra Clean Sputtering Process And High Density Magnetic Recording Media
复制标题
超洁净溅射工艺和高密度磁记录介质
DOI：
10.1109/20.617804
复制
发表时间：
1997
期刊：
影响因子：
--
通讯作者：
J. Nakai
中科院分区：
文献类型：
--
作者：
M. Takahashi;A. Kikuchi;J. Nakai
将超净溅射工艺引入到CoNiCr和CoCrTa薄膜介质的制备中，建立了控制其微观结构和磁性能的新概念。从薄膜的微观结构出发，讨论了薄膜沉积过程清洁度与磁性能的关系。所提出的uc工艺能够控制薄膜介质的精细结构，从而获得优异的磁性能。该研究表明，uc工艺比目前使用的普通工艺优越，在薄膜介质制造中起着主导作用。
The ultra clean sputtering process (UC-process) was newly introduced in the fabrication of CoNiCr and CoCrTa thin film media to establish the new concept of controlling the microstructure and magnetic properties. The relation between cleanness during film deposition process and magnetic properties has been discussed in connection with their microstructure. The UC-process presented enables the control of the fine structure of the thin film media and resulted in excellent magnetic properties. This study demonstrates that the UC-process is very superior to the normal process presently used and plays a dominant role for the thin film media fabrication.