Investigation of the mechanical properties of thin films by nanoindentation, considering the effects of thickness and different coating-substrate combinations
Investigation of the mechanical properties of thin films by nanoindentation, considering the effects of thickness and different coating-substrate combinations
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DOI：
10.1016/j.surfcoat.2004.03.037
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发表时间：
2005-02-01
影响因子：
5.4
通讯作者：
Wang, TC
中科院分区：
文献类型：
--
作者：
Chen, SH;Liu, L;Wang, TC
为了进一步研究薄膜-基底系统的纳米压痕数据，并了解更多关于纳米薄膜-基底系统的机械性能，两种薄膜在不同的基底系统进行了测试，在膜厚度和基底特性的系统变化。这两种薄膜是分别溅射在玻璃和硅衬底上的铝和钨。压痕实验进行纳米压痕XP II与压头位移通常约两倍的标称膜厚度。由此产生的数据进行了分析的载荷-位移曲线和各种比较参数，如硬度，杨氏模量，卸载刚度和弹性恢复。硬度和杨氏模量的调查时，基板的影响被认为是。结果表明，复合硬度和杨氏模量是如何不同的基板，不同的膜和不同的膜厚度。假设薄膜-衬底系统的杨氏模量为常数，薄膜和衬底具有相似的杨氏模量。通过Joslin和奥利弗方法获得的复合硬度与通过奥利弗和法尔方法获得的直接测量硬度进行比较。(C)2004 Elsevier B. V.保留所有权利。
In order to further investigate nanoindentation data of film-substrate systems and to learn more about the mechanical properties of nanometer film-substrate systems, two kinds of films on different substrate systems have been tested with a systematic variation in film thickness and substrate characteristics. The two kinds of films are aluminum and tungsten, which have been sputtered on to glass and silicon substrates, respectively. Indentation experiments were performed with a Nano Indent XP II with indenter displacements typically about two times the nominal film thicknesses. The resulting data are analyzed in terms of load-displacement curves and various comparative parameters, such as hardness, Young's modulus, unloading stiffness and elastic recovery. Hardness and Young's modulus are investigated when the substrate effects are considered. The results show how the composite hardness and Young's modulus are different for different substrates, different films and different film thicknesses. An assumption of constant Young's modulus is used for the film-substrate system, in which the film and substrate have similar Young's moduli. Composite hardness obtained by the Joslin and Oliver method is compared with the directly measured hardness obtained by the Oliver and Pharr method. (C) 2004 Elsevier B.V. All rights reserved.