Characterization of time-dependent variability using 32k transistor arrays in an advanced HK/MG technology

Characterization of time-dependent variability using 32k transistor arrays in an advanced HK/MG technology
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使用先进 HK/MG 技术中的 32k 晶体管阵列表征随时间变化的特性

DOI:
10.1109/irps.2015.7112702
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发表时间:
2015
期刊:
2015 IEEE International Reliability Physics Symposium
影响因子:
--
通讯作者:
G. Groeseneken
G. Groeseneken
中科院分区:
--
文献类型:
--
作者:
P. Weckx;B. Kaczer;C. Chen;J. Franco;E. Bury;K. Chanda;J. Watt;P. Roussel;F. Catthoor;G. Groeseneken

文献摘要

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在这里,我们表明,除了标准的时间零变异性之外,nFET和pFET的时间依赖性变异性可以使用先进的高k/金属栅极(HK/MG)技术制造的大型测试元件组(TEG)上的一系列测量来充分表征和预测,从而使我们能够充分表征底层技术。BTI显示出遵循双峰缺陷中心行为,NBTI与界面层(IL)(SiO2)和HK捕获有关,PBTI与HK和IL/HK界面捕获有关。此外,本文还首次导出了双峰总位移ΔVTH的解析描述,作为广义缺陷中心分布的一种特殊情况,从而准确地描述了分布的尾部。
Here we show that nFET and pFET time-dependent variability, in addition to the standard time-zero variability, can be fully characterized and projected using a series of measurements on a large test element group (TEG) fabricated in an advanced High-k/Metal Gate (HK/MG) technology, thus allowing us to fully characterize the underlying technology. BTI is shown to follow a bimodal defect-centric behavior, for NBTI related to Interface Layer (IL)(SiO2) and HK trapping and for PBTI related to HK and IL/HK interface trapping. Moreover for the first time, an analytical description of the bimodal total ΔVTH shift is derived, as a special case of the generalized defect-centric distribution, which we derive in this work to accurately describe the tail of the distribution.