Impact of surface texture on ultrasonic wire bonding process
Impact of surface texture on ultrasonic wire bonding process
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DOI：
10.1016/j.jmrt.2022.07.187
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发表时间：
2022-08-21
影响因子：
6.4
通讯作者：
Wallaschek, Joerg
中科院分区：
文献类型：
--
作者：
Long, Yangyang;Arndt, Matthias;Wallaschek, Joerg
由于超声波（US）引线键合过程的复杂机制，通常以改变工艺参数（包括法向力、US功率和处理时间）的方式进行优化。在这项研究中，一种新的方式，通过创建不同的表面纹理的基板上被用来改变键合过程和键合过程的改进进行了检测。在玻璃基板上设计并制作了三种不同的表面织构，包括沉积条纹、不同角度的直沟和椭圆沟。结果表明，椭圆形沟槽对键合过程影响不大，而沉积条带和直沟槽对键合过程影响较大。沉积的条带有助于打破氧化皮，并促进氧化物向接触外部的运输。采用直沟，氧化物去除效率显著提高。特别是当驱动电流超过0.45A时，在键合过程中清楚地观察到来自沟的长碎片。这些碎片是铝和氧化铝，它们不断地从电线上切下来，积累在沟槽中，挤压并挤压到触点的外部。随着直沟的角度的不同，粘结足迹的形状可以相应地改变。与光滑表面的粘接相比，具有沉积条带和直沟的基材的粘接强度高出几倍，且偏差较小。键合工艺窗口显著扩大。(c)2022作者（S）由爱思唯尔公司出版。这是一篇开放获取的文章，使用CC BY许可证（http：//creativecommons.org/licenses/by/4.0/）。
Due to the complex mechanisms, the ultrasonic (US) wire bonding process is usually optimized in the way of varying the processing parameters including normal force, US power, and processing time. In this study, a new way by creating different surface textures on substrates was used to alter the bonding process and improvements of the bonding process were detected. Three different surface textures including deposited strips, straight ditches at different angles, and elliptic ditches were designed and created on glass sub-strates. The results showed that the elliptic ditches hardly influence the bonding process while the deposited strips and straight ditches significantly alter the bonding process. The deposited strips help break the oxide scale and facilitate the transportation of oxides to the outside of contact. With the straight ditches, the oxide removal efficiency was significantly enhanced. Especially when the driving current exceeded 0.45 A, long chips from the ditches were clearly observed during the bonding process. The chips were aluminum and aluminum oxide which were continuously cut from the wire, accumulated in the ditches, pressed and squeezed to the outside of the contact. With a different angle of the straight ditches, the shape of the bonding footprint can be changed correspondingly. Compared to the bonding on smooth surfaces, the bonding strength on substrates with deposited strips and straight ditches was a few times higher and had a smaller deviation. The bonding process window was significantly enlarged.(c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).