Reversal imprinting by transferring polymer from mold to substrate
Reversal imprinting by transferring polymer from mold to substrate
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DOI：
10.1116/1.1523404
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发表时间：
2002-11-01
影响因子：
1.4
通讯作者：
Yee, AF
中科院分区：
文献类型：
--
作者：
Huang, XD;Bao, LR;Yee, AF
本研究开发了一种反转印迹技术。首先将聚合物层旋转涂覆在有图案的硬模具上，然后在高温高压下转移到基板上。与传统的纳米压印技术相比，反向压印技术有一个优势，它允许在不易自旋涂覆的基板上进行压印，例如柔性聚合物基板。反转压印的另一个独特的特点是，通过控制旋转涂层后模具表面平整化程度，可以实现三种不同的图案转移模式。聚合物抗蚀剂以及压印温度：“压花”发生在远高于聚合物的玻璃化转变温度（T-g）的温度下；在T-g左右的温度下，模具表面的聚合物涂层非平面化，发生“上墨”；“全层转移”发生在T-g左右的温度下，但表面有点平坦。这三种压印模式与聚合物涂层后模具表面平面化程度和压印温度有定量关系。(C) 2002年美国真空学会。
A reversal imprinting technique was developed in this study. A polymer layer was first spin coated on a patterned hard mold, and then transferred to a substrate under an elevated temperature and pressure. The reversal imprinting method offers an advantage over conventional nanoimprinting by allowing imprinting onto substrates that cannot be easily spin coated, such as flexible polymer substrates. Another unique feature of reversal imprinting is that three different pattern-transfer modes can be achieved by controlling the degree of surface planarization of the mold after spin coating the. polymer resist as well as the imprinting temperature: "Embossing" occurs at temperatures well above the glass transition temperature (T-g) of a polymer; "inking" occurs at temperatures around T-g with nonplanarized polymer coating surface on the mold; and "whole-layer transfer" occurs at temperatures around T-g but with a somewhat planarized surface. These three imprinting modes have been quantitatively correlated with the surface planarization of the mold after polymer coating and the imprinting temperature. (C) 2002 American Vacuum Society.