Postdeposition-Anneal Effect on Negative Bias Temperature Instability in HfSiON Gate Stacks
Postdeposition-Anneal Effect on Negative Bias Temperature Instability in HfSiON Gate Stacks
复制标题
沉积后退火对 HfSiON 栅极堆栈负偏压温度不稳定性的影响
DOI:
10.1109/tdmr.2007.897516
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发表时间:
2007
影响因子:
2
通讯作者:
M. Heyns
中科院分区:
文献类型:
--
作者:
M. Aoulaiche;M. Houssa;T. Conard;S. De Gendt;G. Groeseneken;H. Maes;M. Heyns
The effect of postdeposition anneals in various ambients on negative bias temperature instability (NBTI) in metal-organic chemical-vapor-deposited HfSiO(N) stacks is investigated. The nitrided stacks, either by anneal or decoupled plasma nitridation (DPN) followed by a postnitridation anneal in O2 or N2 (DPN + O2 and DPN + N2 ), are more degraded by NBTI than the nonnitrided ones (O2, N2 anneal, and as deposited stacks). Moreover, none of the nitrided stacks reaches the 10-year NBTI lifetime, while the lifetime for the nonnitrided ones is larger than 10 years. Nitrogen profiles measured by X-ray photoelectrons spectroscopy and charge-pumping-current data show a relation between nitrogen location and positively charged defects in the gate stack. The additional NBT degradation in nitrided stacks is due to filling or generation of nitrogen-related defects by holes that are injected from the channel.