Expanding Pd-catalyzed C-N bond-forming processes: The first amidation of aryl sulfonates, aqueous amination, and complementarity with Cu-catalyzed reactions
Expanding Pd-catalyzed C-N bond-forming processes: The first amidation of aryl sulfonates, aqueous amination, and complementarity with Cu-catalyzed reactions
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DOI：
10.1021/ja035483w
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发表时间：
2003-06-04
影响因子：
15
通讯作者：
Buchwald, SL
中科院分区：
文献类型：
--
作者：
Huang, XH;Anderson, KW;Buchwald, SL
利用配体1开发了第一个钯催化芳基甲苯磺酸盐和苯磺酸盐胺化的通用方法，配体1属于新一代联芳基单膦配体。此外，新的催化剂系统首次实现了芳基芳烃磺酸盐的酰胺化和水性胺化方案，而无需使用共溶剂。底物范围已显着扩大，包括含有伯酰胺和游离羧酸基团的芳基卤。对于多功能基材，Pd 催化的胺化可以提供与 Cu 催化的 CN 键形成过程互补的选择性。
The first general method for the Pd-catalyzed amination of aryl tosylates and benzenesulfonates was developed utilizing ligand1, which belongs to a new generation of biaryl monophosphine ligands. In addition, the new catalyst system for the first time enables amidation of aryl arenesulfonates and aqueous amination protocols that do not necessitate the use of cosolvents. The substrate scope has been significantly expanded to include aryl halides containing primary amides and free carboxylic acid groups. In the case of multifunctional substrates, the Pd-catalyzed amination can provide selectivity that is complementary to the Cu-catalyzed C−N bond-forming processes.