Cu/Multiwalled Carbon Nanotube Composite Films Fabricated by Pulse-Reverse Electrodeposition
Cu/Multiwalled Carbon Nanotube Composite Films Fabricated by Pulse-Reverse Electrodeposition
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DOI：
10.1149/1.3518414
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发表时间：
2011-02
影响因子：
3.9
通讯作者：
S. Arai;Y. Suwa;M. Endo
中科院分区：
文献类型：
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作者：
S. Arai;Y. Suwa;M. Endo
为提高铜/多壁碳纳米管(MWCNT)复合镀膜的质量分数，采用脉冲反相(PR)电沉积方法进行了研究。用扫描电子显微镜和X射线衍射仪研究了复合膜的电沉积和溶解行为，确定了PR电沉积的最佳电沉积和溶解电流密度。通过改变电流反向比，在最合适的电沉积和溶解电流密度下进行了铜/多壁碳纳米管复合膜的Pr电沉积。随着阳极电流密度的变化，溶解后的铜/多壁碳纳米管复合膜的表面形貌发生了明显的变化。PR电沉积法制备的复合膜的MWCNT含量高于直流电沉积法制备的复合膜的MWCNT含量，最大值为0.59质量%，比直流电沉积提高40%。此外，PR电沉积法制备的复合薄膜的表面粗糙度小于直流电沉积。
Cu/multiwalled carbon nanotube (MWCNT) composite plating by a pulse-reverse (PR) electrodeposition method was investigated in order to increase the MWCNT content of the composite plating films. The electrodeposition and dissolution behaviors of the composite films were investigated using scanning electron microscopy and X-ray diffraction to determine the most suitable electrodeposition and dissolution current densities for PR electrodeposition. PR electrodeposition of the Cu/MWCNT composite films was conducted by varying the current reverse ratios at the most suitable electrodeposition and dissolution current densities. The surface morphology of the Cu/MWCNT composite films after dissolution was significantly changed by variation of the anodic current densities. The MWCNT content of the composite films formed by PR electrodeposition was greater than that obtained using a direct current (dc) electrodeposition method, and reached a maximum value of 0.59 mass %, which is a 40% increase over that for dc electrodeposition. Furthermore, the surface roughness of the composite films fabricated by PR electrodeposition was less than that by dc electrodeposition.