Rapid and low-cost prototyping of 3D nanostructures with multi-layer hydrogen silsesquioxane scaffolds.
Rapid and low-cost prototyping of 3D nanostructures with multi-layer hydrogen silsesquioxane scaffolds.
复制标题
使用多层氢倍半硅氧烷支架快速、低成本地制作 3D 纳米结构原型。
DOI：
10.1002/smll.201301658
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
Qi,Minghao
中科院分区：
文献类型：
--
作者：
Varghese,LeoT;Fan,Li;Wang,Jian;Xuan,Yi;Qi,Minghao
逐层（LBL）方法可以生成或近似任何三维（3D）结构，并且已经成为用于制造互补金属氧化物半导体（CMOS）器件的方法。然而，它的高成本排除了CMOS兼容设备之外的任何其他设备的制造，并且由于缺乏昂贵的设备和最先进的工具，一般的3D纳米结构很难在学术界和小企业中进行原型制作。提出并证明了一种新的方法，可以以低成本快速制造高分辨率的三维（3D）纳米结构，而不需要专门的设备。通过氢倍半硅氧烷（HSQ）抗蚀剂的电子束光刻图案化实现单个层，然后通过旋转SU-8抗蚀剂和回蚀进行平坦化。展示了周期为650 nm的4层硅逆木堆光子晶体和周期为300 nm的7层HSQ支架。该过程为高度复杂的3D纳米结构的制造提供了通用且可访问的解决方案。
A layer‐by‐layer (LBL) method can generate or approximate any three‐dimensional (3D) structure, and has been the approach for the manufacturing of complementary metal‐oxide‐semiconductor (CMOS) devices. However, its high cost precludes the fabrication of anything other than CMOS‐compatible devices, and general 3D nanostructures have been difficult to prototype in academia and small businesses, due to the lack of expensive facility and state‐of‐the‐art tools. It is proposed and demonstrated that a novel process that can rapidly fabricate high‐resolution three‐dimensional (3D) nanostructures at low cost, without requiring specialized equipment. An individual layer is realized through electron‐beam lithography patterning of hydrogen silsesquioxane (HSQ) resist, followed by planarization via spinning SU‐8 resist and etch‐back. A 4‐layer silicon inverse woodpile photonic crystal with a period of 650 nm and a 7‐layer HSQ scaffold with a period of 300 nm are demonstrated. This process provides a versatile and accessible solution to the fabrication of highly complex 3D nanostructures.