High Rate Etching of Polymers by Means of an Atmospheric Pressure Plasma Jet
High Rate Etching of Polymers by Means of an Atmospheric Pressure Plasma Jet
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DOI：
10.1002/ppap.201000093
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发表时间：
2011-01-20
影响因子：
3.5
通讯作者：
Weltmann, Klaus-Dieter
中科院分区：
文献类型：
--
作者：
Fricke, Katja;Steffen, Hartmut;Weltmann, Klaus-Dieter
大气压等离子体对表面的影响，特别是其在不同材料改性和去污方面的潜在应用已经得到了深入的研究。在这项研究中，大气压等离子体射流的蚀刻能力。各种聚合物[例如，聚乙烯和聚（醚醚酮）]暴露于纯氩和氩/氧等离子体。探讨了氧混合物（最多1%）和喷射喷嘴到衬底的距离对化学性质不同的聚合物的蚀刻速率的影响。特别注意的是适用于大气压等离子体的生物膜去除的可行性。出于这个原因，假设每个聚合物代表细菌细胞的模型化合物。通过测定等离子体暴露后的质量损失和蚀刻曲线来获得蚀刻速率。实验表明，活性氧物种起着重要的作用，在聚合物的去除，导致在50至300 nm的蚀刻速率。s（-1）取决于聚合物材料。这些高蚀刻速率意味着非热大气等离子体射流可用于从表面去除包括微生物的有机材料。
The impact of atmospheric pressure plasma on surfaces, in particular its potential application of modification and decontamination of different materials has been intensively investigated. In this study, the etching capability of an atmospheric pressure plasma jet is shown. A variety of polymers [e.g., polyethylene and poly (ether ether ketone)] was exposed to pure argon and argon/oxygen plasma. The influence of the oxygen admixture (up to 1%) and of the jet-nozzle to substrate distance on the etch rate of chemically different polymers was explored. Particular attention was applied on the feasible use of atmospheric pressure plasma on biofilm removal. For that reason a theory was postulated with each polymer representing a model compound of bacterial cells. The etch rates were obtained by determination of the mass loss and etch profiles after plasma exposure. The experiments showed that reactive oxygen species play an important role in the polymer removal which results in etch rates of 50 up to 300 nm . s(-1) depending on the polymeric material. These high etch rates imply that non-thermal atmospheric plasma jets could be used for removal of organic material including micro-organisms from surfaces.