Forced-flow thermocells that generate electric power during cooling
Forced-flow thermocells that generate electric power during cooling
复制标题
在冷却过程中产生电力的强制流动热电池
DOI:
10.11470/jsaprev.230408
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发表时间:
2023
期刊:
影响因子:
--
通讯作者:
Yutaka Ikeda
中科院分区:
文献类型:
--
作者:
Yoichi Murakami;Yutaka Ikeda
Electronic devices and heat engines consume electricity and fuel, respectively, which generates and exhausts heat. Such heat generation sources are often cooled by forced convection cooling, in which a fluid flows over an object to be cooled by a pump. Forced-flow liquid cooling has been adopted for power semiconductors [1], CPUs in data centers [2], and electric vehicle batteries [3]. Because heat is a kind of energy, not utilizing the generated heat is considered a loss of opportunity. However, it is important to note that this type of heat is troublesome exhaust heat rather than discarded (or abandoned) heat. The latter is, for example, heat extractable from warm secondary cooling water ejected from a power plant; such heat can be utilized freely after it leaves the location where it is generated [4]. Figure 1 (a) shows the surface of a heat-dissipating object (at temperature TH (K)) and the flow of the coolant used to cool it (at a mixed-mean temperature TL (K)). Here, denoting the thermal energy generated in the object per 1 s by Etherm (J) and assuming a steady state, the heat of Q= Etherm (J) is being transferred from the hot object to the coolant per 1 s (note the difference between “thermal energy” and “heat”[5]). Thermal energy is conserved during this transfer. However, in the situation shown in Fig. 1 (a), the exergy [5] of the thermal energy is irreversibly reduced owing to the decrease in temperature; more work could be generated using Etherm at TH in the initial state than using Etherm at TL in the final state. This can be regarded as a situation in which a water wheel is not installed even though there is a water fall. Previously, this point was not addressed because it was hidden behind the urgency of cooling.Notably, the insertion of a thermoelectric plate into a solid (hot object to be cooled)–liquid (coolant) interface does not yield the intended consequence [4]. This is because near the solid–liquid interface, through which heat is transferred, the largest temperature drop usually occurs in the thermal boundary layer in the fluid flowing on the solid surface. In other words, the greatest temperature drop between the heat source and environment occurs across the thermal boundary layer, which usually has the largest thermal resistance, rather than across the thermoelectric plate [4]. This is the basis of the concept of the proposed technology.