Plasticity-Creep Separation Method for Viscoplastic Deformation of Lead-Free Solders
Plasticity-Creep Separation Method for Viscoplastic Deformation of Lead-Free Solders
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DOI：
10.1299/jsmea.47.371
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发表时间：
2004-07
期刊：
影响因子：
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通讯作者：
K. Ohguchi;K. Sasaki;M. Ishibashi;Takamichi Hoshino
中科院分区：
文献类型：
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作者：
K. Ohguchi;K. Sasaki;M. Ishibashi;Takamichi Hoshino
本文将作者提出的本构模型应用于Sn/Ag、Sn/Bi和Sn/Zn三种无铅钎料合金。首先，使用所谓的“塑性-蠕变分离法”，通过简单的试验，如纯拉伸试验，确定本构模型中的材料常数。本构模型被纳入一个通用的有限元程序ANSYS使用应力积分法。无铅焊料的材料常数可以简单地确定仅使用三个应变速率的纯拉伸试验获得的数据。使用“塑性-蠕变分离法”确定的材料常数，通过本构模型模拟蠕变和循环变形等基本机械变形。利用本构模型对电子封装回流焊过程中的热变形进行了模拟。
This paper applies a constitutive model proposed previously by the authors to three lead-free solder alloys of Sn/Ag, Sn/Bi and Sn/Zn. First, the material constants in the constitutive model are determined using the so-called “plasticity-creep separation method” by simple tests such as pure tensile tests. The constitutive model is incorporated into a general purpose Finite Element Method program ANSYS using the stress integration method. The material constants for the lead-free solders could be simply determined using only the data obtained by the pure tensile tests with three strain rates. The basic mechanical deformation such as creep and cyclic deformation are simulated by the constitutive model using the material constants determined using the “plasticity-creep separation method”. Thermal deformation during a reflow process with electronic packaging is also simulated by the constitutive model.