Radiation Hardened Coarse-Grain Reconfigurable Architecture for Space Applications

Radiation Hardened Coarse-Grain Reconfigurable Architecture for Space Applications
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适用于空间应用的抗辐射粗粒可重构架构

DOI:
10.1109/ipdps.2007.370379
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发表时间:
2007
期刊:
2007 IEEE International Parallel and Distributed Processing Symposium
影响因子:
--
通讯作者:
A. Stoica
A. Stoica
中科院分区:
--
文献类型:
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作者:
S. Baloch;T. Arslan;A. Stoica

文献摘要

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技术趋势使得单事件效应 (SEE) 很可能成为未来更加令人担忧的问题。减小特征尺寸、降低工作电压和提高速度,所有这些都会增加对单粒子翻转 (SEU) 的敏感性。航空电子设备的混乱是一个既定的问题。地面的扰动正成为地面应用微电子制造商关注的问题。倒装芯片封装和多层金属的使用进一步加剧了这个问题。商业制造商无法接受增加晶体管数量或降低 IC 性能的典型缓解方法。 SOI 技术可能在这方面有所帮助,但并不是解决所有 SEE 问题的灵丹妙药。我们提出了独特的方案来建模和纠正可重构架构的组合和同步部分中的单事件中断。我们将我们的方案与已经引入的不同方案进行比较,并报告结果以证明所提出的抗辐射可重构架构的有效性。
Technology trends are such that single event effects (SEE) are likely to become even more of a concern for the future. Decreasing feature sizes, lower operating voltage, and higher speeds, all conspire to increase susceptibility to single event upsets (SEU). Upset in avionics is an established concern. Upset at the ground level is becoming a concern for manufacturers of microelectronics for terrestrial applications. The use of flip-chip packaging and multiple levels of metals further exacerbate the problem. Typical methods of mitigation that either increase the transistor count or reduce IC performance are not acceptable to commercial manufacturers. SOI technology may help in this regard, but is not a magic bullet to end all SEE concerns. We present unique schemes to model and rectify single event disruption in combinatorial and synchronous parts of a reconfigurable architecture. We compare our scheme with different schemes already introduced and results are reported to prove the efficacy of the proposed radiation hardened reconfigurable architecture.