60 GHz capacitively probe-fed patch arrays with suspended elements
60 GHz capacitively probe-fed patch arrays with suspended elements
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具有悬挂元件的 60 GHz 电容式探头馈电贴片阵列
DOI：
10.23919/eucap.2017.7928510
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发表时间：
2017
期刊：
影响因子：
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通讯作者：
N. Ghalichechian
中科院分区：
文献类型：
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作者：
Kaveh Keshtkaran;N. Ghalichechian
当前用于在芯片上集成相控阵的毫米波技术的一个主要缺点是效率低（5-10%），因此实现的增益低。在这项工作中，我们提出了硅上集成天线阵列，其在 60 GHz 下的辐射效率 >80%。这是通过使用微机电系统 (MEMS) 工艺将相控阵的辐射元件悬浮在空气中来实现的，从而有效地用空气取代了有损耗的硅基板（每个元件下方）。在最新的设计中，我们使用引脚和贴片高度分别为 40 和 60 μm 的电容馈电。有限元仿真结果验证了阵列的性能。具有 5×5 元件的有限阵列实现了 1.7 GHz 的 −10 dB 带宽。阵列在 60 GHz 下匹配良好，S11<−19 dB。最大实现增益（宽边）为 20 dBi，旁瓣电平为 -13.3 dB。计算效率为89%。将天线集成在芯片上为系统小型化提供了巨大优势，对于下一代有源电子扫描阵列至关重要。
A major drawback of current millimeter-wave technologies used for integration of phased arrays on a chip is low efficiency (5–10%) and consequently low realized gain. In this work, we present integrated antenna arrays on silicon that exhibit radiation efficiency of >80% at 60 GHz. This is achieved by suspending the radiating elements of a phased array in air using micro-electro-mechanical systems (MEMS) processes, effectively replacing a lossy silicon substrate (under each element) with air. In the latest design we used capacitive feeding with pin and patch height of 40 and 60 μm, respectively. Finite element simulation results verify the performance of the array. A finite array with 5×5 elements achieved −10-dB bandwidth of 1.7 GHz. Array is well matched at 60 GHz with S11<−19 dB. Maximum realized gain (at broadside) is 20 dBi with sidelobe level of −13.3 dB. The efficiency is calculated to be 89%. Integration of antenna on a chip, provides enormous advantage in miniaturization of the systems and is essential for next-generation active electronically scanned arrays.