Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water
Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water
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DOI：
10.1007/s10854-006-6764-0
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发表时间：
2006-03
期刊：
影响因子：
--
通讯作者：
D. Yu;W. Jillek;E. Schmitt
中科院分区：
文献类型：
--
作者：
D. Yu;W. Jillek;E. Schmitt
电化学迁移（ECM）是电子焊接中潜在的可靠性问题，在无铅电子器件中可能变得更加危险。采用恒压法对Sn-Pb和无铅钎料合金在蒸馏水中进行了电化学迁移试验。研究了钎料合金的电化学加工敏感性以及钎料合金成分对电化学加工行为的影响。结果表明，Sn-Pb钎料和无铅钎料均具有电化学腐蚀敏感性。枝晶从阴极到阳极生长，并显示出不同的形态与不同的迁移元素参与。Sn-37 Pb和Sn-36 Pb-2Ag钎料中的主要迁移元素为Pb。而对于Sn-Ag和Sn-Ag-Cu钎料合金，Sn是导致迁移的主要原因。对于Sn-8 Zn-3Bi，Sn和Zn都可以迁移。此外，还研究了外加电压对短路时间和短路电阻的影响。正如可以预期的那样，电压越高，故障时间越短。对钎料合金的电化学迁移机理进行了探讨。
Electrochemical migration (ECM) is a potential reliability problem in electronic soldering which might become more dangerous in lead free electronic devices. In this paper, electrochemical migration tests on Sn-Pb and lead free solder alloys were conducted under distilled water by applying constant voltages with a power supply. The susceptibility of the solder alloys to ECM and the effect of the composition on ECM behavior were studied. It is found that both Sn-Pb and lead free solders investigated in present research have susceptibility on ECM. Dendrites grow from cathode to anode and show different morphologies with the different migration elements involved. In Sn-37Pb and Sn-36Pb-2Ag solders, the main migration element is Pb. While for Sn-Ag and Sn-Ag-Cu solder alloys, Sn leads the migration. For Sn-8Zn-3Bi, both Sn and Zn can migrate. Furthermore, the effect of applied voltage on the time to short and short resistance was also investigated. As could be expected, the higher the voltage is, the shorter the failure time is. The electrochemical migration mechanism of the solder alloys was also discussed.