Synthesis and characterization of hafnium oxide and hafnium aluminate ultra-thin films by a sol–gel spin coating process for microelectronic applications
Synthesis and characterization of hafnium oxide and hafnium aluminate ultra-thin films by a sol–gel spin coating process for microelectronic applications
复制标题
用于微电子应用的溶胶-凝胶旋涂工艺合成和表征氧化铪和铝酸铪超薄膜
DOI:
10.1016/j.jnoncrysol.2006.10.041
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发表时间:
2007
影响因子:
3.5
通讯作者:
S. Santucci
中科院分区:
文献类型:
--
作者:
A. R. Phani;M. Passacantando;S. Santucci
Currently there are intense industry-wide efforts in searching for new high dielectric constant (high-k) materials for use in future generations of ultra-large scale integrated circuits (ULSI). There are number of requirements for the new high-k materials, such as high dielectric constant, thermal stability (400°C or higher), high mechanical strength, and good adhesion to neighboring layers. Oxide spinels comprise a very large group of structurally related compounds many of which are of considerable technological significance. Spinels exhibit a wide range of electronic and magnetic properties in particular nickel, hafnium, cobalt, containing spinels. In the present investigation, crack free, dense polycrystalline monoclinic structure of pure HfO2, and Al2HfO5ultra-thin films have been prepared by a simple and cost effective sol–gel spin coating method. The formation of the monoclinic HfO2phase at 600°C and complete formation of the single phase Al2HfO5at 800°C has been reported. The composition of the annealed films has been measured and found to be 70at.% of O, 30at.% of Hf for HfO2and 22at.% of Al, 12at.% of Hf and 66at.% of O for Al2HfO5films, which are close to the stoichiometry of the HfO2and Al2HfO5thin films.