Novel CuI Ethylene Complexes with 6,6′‐Diphenyl‐4,4′‐bipyrimidine Three‐Dimensionally Self‐Assembled by an Intermolecular π‐π Stacking Interaction and a C–H···N Contact
Novel CuI Ethylene Complexes with 6,6′‐Diphenyl‐4,4′‐bipyrimidine Three‐Dimensionally Self‐Assembled by an Intermolecular π‐π Stacking Interaction and a C–H···N Contact
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DOI:
10.1002/ejic.200900533
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发表时间:
2009-10
影响因子:
2.3
通讯作者:
M. Maekawa;T. Tominaga;T. Okubo;T. Kuroda–Sowa;M. Munakata
中科院分区:
文献类型:
--
作者:
M. Maekawa;T. Tominaga;T. Okubo;T. Kuroda–Sowa;M. Munakata
Four novel CuI–Ph2bpm/C2H4 adducts [Cu(Ph2bpm)(C2H4)]X [X = BF4 (1a, 1b), ClO4 (2) and PF6 (3); Ph2bpm = 6,6′-diphenyl-4,4′-bipyrimidine] were prepared and they have been characterized by X-ray, 1H NMR, IR and TG-DTA analyses. The molecular structures of CuI–Ph2bpm/C2H4 complexes 1a, 1b, 2 and 3 are essentially similar: the Cu atom is coordinated by two N atoms in the chelate site of Ph2bpm and the C=C bond of C2H4 in the trigonal-planar geometry. Interestingly, their crystal packing structures are much different from the connection manners of an intermolecular π–π stacking interaction and a C–H···N contact, resulting in the self-assembly of CuI–C2H4 adducts with a unique three-dimensional network structure. The X-ray, 1H NMR, IR data support the assumption that the contribution of the larger CuIC2H4 π back-donation bonding is induced by the electron-releasing phenyl group. (© Wiley-VCH Verlag GmbH & Co. KGaA, 69451 Weinheim, Germany, 2009)