Process development of precision surface micro-machining using mechanical abrasion and chemical etching
Process development of precision surface micro-machining using mechanical abrasion and chemical etching
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DOI：
10.1007/s00542-002-0193-7
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发表时间：
2002-09
期刊：
影响因子：
--
通讯作者：
Jin-Eui Lee;I. Sung;Dae-Eun Kim
中科院分区：
文献类型：
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作者：
Jin-Eui Lee;I. Sung;Dae-Eun Kim
已经开发出一种能够对金属和硅材料的表面进行微加工的工艺。这一过程是基于使用非常锋利和坚硬的工具对表面进行机械磨损，然后在某些情况下进行化学蚀刻。机械磨损过程中最关键的参数是推力，它基本上决定了切割的方式。使用专门建造的具有亚微米进给分辨率的精密可编程机床进行了实验，以确定获得满意切割的最佳操作条件。通过仔细调整刀具的进给量，也可以相当成功地加工出凹槽。为了展示该工艺的灵活性，在硅和黄铜上加工了一个微型表面。本文提出的微加工工艺也可用于制造微模具和微槽。
A process that is capable of micro-machining the surface of both metallic and silicon materials has been developed. The process is based on mechanical abrasion of the surface using a very sharp and hard tool followed by chemical etching in some instances. The most critical parameter for the mechanical abrasion process is the thrust force which essentially dictates the mode of cutting. Experiments were performed using a specially built precision programmable machine with sub-micrometer feed resolution to identify the optimum operating conditions to obtain satisfactory cutting. By carefully adjusting the feed of the tool, pockets could also be machined quite successfully. In order to demonstrate the flexibility of the process, a miniature face was machined on both silicon and brass. The micro-machining process presented in this work can also be used to fabricate micro-molds as well as micro-grooves.