Direct Liquid Cooling for Electronic Equipment

Direct Liquid Cooling for Electronic Equipment
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电子设备直接液体冷却

DOI:
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发表时间:
2014
期刊:
影响因子:
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通讯作者:
S. Greenberg
S. Greenberg
中科院分区:
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文献类型:
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作者:
Henry Coles;S. Greenberg

文献摘要

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摘要:本文介绍了一种可应用于数据中心的电子设备冷却系统在工程样机开发阶段的演示。该技术通过将水基冷却液直接与产生高热量的电子元件接触来提供冷却。这种直接冷却系统从三个方面提高了数据中心的整体能源效率:产生高热量的电子元件可以更有效地直接用水冷却,从而捕获电子设备产生的大部分热量。这种捕获的热量减少了效率较低的基于空气的数据中心房间冷却系统的负荷。这种组合有助于整体节省。配备此冷却系统后,电子设备内部风扇的功耗显著降低。提供给直接冷却系统的冷却水的温度可以比设施冷冻水回路通常提供的温度高得多,因此可以以较低的冷却基础设施能耗和可能的无压缩机冷却来生产。提供热再利用的机会是这项技术的另一个好处。可以控制冷却系统,在提供足够的部件冷却的同时,产生高回水温度。演示是在位于加州伯克利的劳伦斯伯克利国家实验室的一个数据中心进行的。38台配备了液体冷却系统和能量测量仪器的服务器被放置在一个机架上。位于相邻机架上的两台相同配置的未修改服务器用于提供基线。该演示展示了直接冷却技术去除的热量比例,量化了许多冷却基础设施场景的节能效果,并提供了可用于研究热量再利用机会的信息。热测量数据与数据中心能源使用建模软件一起使用,以估计整个站点的能源使用。这些估计表明,如果按照所使用的模型中指定的方式对数据中心进行改造,预计可以节省大约20%的总体数据中心能源。增加该技术捕获的热量的比例是一个建议进一步发展的领域。
Author(s): Coles, Henry | Abstract: This report documents a demonstration of an electronic--equipment cooling system in the engineering prototype development stage that can be applied in data centers. The technology provides cooling by bringing a water--based cooling fluid into direct contact with high--heat--generating electronic components. This direct cooling system improves overall data center energy efficiency in three ways: High--heat--generating electronic components are more efficiently cooled directly using water, capturing a large portion of the total electronic equipment heat generated. This captured heat reduces the load on the less--efficient air--based data center room cooling systems. The combination contributes to the overall savings. The power consumption of the electronic equipment internal fans is significantly reduced when equipped with this cooling system. The temperature of the cooling water supplied to the direct cooling system can be much higher than that commonly provided by facility chilled water loops, and therefore can be produced with lower cooling infrastructure energy consumption and possibly compressor-free cooling. Providing opportunities for heat reuse is an additional benefit of this technology. The cooling system can be controlled to produce high return water temperatures while providing adequate component cooling. The demonstration was conducted in a data center located at Lawrence Berkeley National Laboratory in Berkeley, California. Thirty--eight servers equipped with the liquid cooling system and instrumented for energy measurements were placed in a single rack. Two unmodified servers of the same configuration, located in an adjacent rack, were used to provide a baseline. The demonstration characterized the fraction of heat removed by the direct cooling technology, quantified the energy savings for a number of cooling infrastructure scenarios, and provided information that could be used to investigate heat reuse opportunities. Thermal measurement data were used with data center energy use modeling software to estimate overall site energy use. These estimates show that an overall data center energy savings of approximately 20 percent can be expected if a center is retrofitted as specified in the models used. Increasing the portion of heat captured by this technology is an area suggested for further development.