Interface delamination of bi‐material structure under dynamic time harmonic loading
Interface delamination of bi‐material structure under dynamic time harmonic loading
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动态时间谐波载荷下双材料结构的界面分层
DOI：
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发表时间：
2011
期刊：
影响因子：
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通讯作者：
B. Gambin
中科院分区：
文献类型：
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作者：
J. Ivanova;G. Nikolova;B. Gambin
研究了二维弹性结构在动态时谐载荷作用下的界面行为。采用“剪力滞模型”，并将其应用于双材料结构的动力响应，假设界面的弹脆性行为。利用拉普拉斯变换和半解析计算获得正弦载荷下界面上的剪切应力和弹性脱粘长度沿着。通过现代陶瓷-金属复合材料（所谓的金属陶瓷）的示例说明了对所获得结果的参数分析，并在图中进行了描述。讨论了加载特性，即频率和振幅波动对剪切应力和小时间间隔的脱粘长度值的影响。
The interface behaviour between two layers of 2D elastic structure under dynamic time‐harmonic load is studied. The “shear lag model” is adopted and applied to the dynamic response of bi‐material structure, assuming the elastic‐brittle behaviour of the interface. The Laplace transforms together with half‐analytical calculations are used to obtain the shear stress and elastic debond lengths along the interface at sinusoidal load. Parametric analysis of the obtained results is illustrated by an example of the modern ceramic‐metal composite, so called cermet, and depicted in figures. The influence of loading characteristics, i.e. frequencies and amplitude fluctuations on the shear stress and the value of debond length for a small interval of time, is discussed.