EFFECT OF AN INTERFACE DEFECT IN A PATCH/LAYER JOINT UNDER DYNAMIC TIME HARMONIC LOAD
EFFECT OF AN INTERFACE DEFECT IN A PATCH/LAYER JOINT UNDER DYNAMIC TIME HARMONIC LOAD
复制标题
动态时谐波载荷下补片/层接头中界面缺陷的影响
DOI:
10.1002/cepa.543
复制
发表时间:
2017
期刊:
影响因子:
--
通讯作者:
T. Petrova
中科院分区:
文献类型:
--
作者:
E. Kirilova;W. Becker;J. Ivanova;T. Petrova
The study deals with the response of a smart patch/layer joint with interface defect (gap) subjected to dynamic time harmonic mechanical and electric load at environmental conditions. In order to find the axial displacements, shear stress and interface debond length in a closed analytical form a 1D modified, shear lag analysis is used. At given joint geometry and three different positions of the gap, a genetic algorithm is implemented to find the values of the model parameters at which a vanishing/minimal debond length is ensured. Moreover, for each optimal solution the influence of the length of the gap as well as the model parameters on the length of the interface debond length is investigated.
影响因子:
2.8
作者:
J. Ivanova;V. Valeva;T. Petrova;W. Becker
通讯作者:
W. Becker
DOI:
--
发表时间:
2017
期刊:
影响因子:
--
作者:
E. Kirilova;T. Petrova;W. Becker;J. Ivanova
通讯作者:
J. Ivanova
DOI:
--
发表时间:
2016
期刊:
影响因子:
--
作者:
Shreya M. Banerjee;Sitikantha Roy
通讯作者:
Sitikantha Roy