Electroless Copper Plating onto Polyimide Using Polymer Nanosheet as a Nano-Adhesive
Electroless Copper Plating onto Polyimide Using Polymer Nanosheet as a Nano-Adhesive
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DOI：
10.1295/polymj.pj2006099
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发表时间：
2007-01
期刊：
影响因子：
2.8
通讯作者：
J. Matsui;K. Kubota;Y. Kado;T. Miyashita
中科院分区：
文献类型：
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作者：
J. Matsui;K. Kubota;Y. Kado;T. Miyashita
在本文中，我们描述了一种技术，使用聚合物纳米片作为纳米粘附在聚酰亚胺薄膜上制备铜层。我们采用了两种功能聚合物纳米片：一种作为粘附层，另一种作为模板层，吸附金纳米颗粒，作为化学镀的催化剂。光反应性聚合物纳米片用于增加铜层与聚酰亚胺之间的粘附力。此外，阳离子聚合物纳米片用于吸附用于化学镀铜的金催化剂。应用该技术，化学镀铜牢固地附着在聚酰亚胺薄膜上。微米铜线路是通过对聚合物纳米片进行微图案化来制造的。使用聚合物纳米片作为粘合剂的过程不需要对聚酰亚胺基底进行表面改性，并且能够在不排放有害废物的情况下进行微米级铜线制造。因此，该技术可用于下一代柔性印刷板制造。
In this paper, we describe a technique to prepare a copper layer on polyimide film using a polymer nanosheet as a nano-adhesion. We employ two kinds of functional polymer nanosheets: one works as an adhesion layer and the other works as a template layer to adsorb gold nanoparticles, which works as a catalyst for the electroless plating. The photoreactive polymer nanosheet was used to increase the adhesion force between the copper layer and polyimide. Furthermore, the cationic polymer nanosheets were used to adsorb a gold catalyst for electroless copper plating. Applying the technique, electroless plated copper was attached strongly onto polyimide film. Micrometer copper lines were fabricated by photopatterning the polymer nanosheets. The process using polymer nanosheets as an adhesive required no surface modification of polyimide substrate and enabled microscale copper line fabrication without discharging harmful waste. Consequently, the technique is useful for next-generation flexible printed board fabrication.